Materials…
- GR, GY, GP, GX, GT, GI (glass-filled woven, non-woven PTFE, ceramic filled Teflon, polyimide)
- Duroid
- Metal-backed aluminum, brass, copper with specialty finishes
- All above materials conform to applicable suffix number of MIL-P-13949G
- BEND/FLEX 1400 & 2400 series
Plating…
- PTH with surface-to-hole ratio of 1.1:1 with aspect ratio of 18:1
- Controlled plating thickness distribution variation from center to panel edges of less than 8%
- Separate front-to-back retification eliminates thickness variation due to circuit versus land area differences
- Consistent elongation of 28 with tensile strength of 48K psi
Electrolytic & Electroless Deposited Metals…
- Copper
- Tin-lead
- Tin
- Nickel
- Gold (soft, hard)
- Immersion tin
- Silver
- Special finishes: anodizing (clear coat or colors), electropolishing, conversion coating, chromate coatings
Etching…
- Trace widths and air gaps of .003″
- Etching tolerances of +/- .0005″ on trace widths and air gaps maintained on 1 oz. copper
Machining…
- Excellon Mark VI Drillers with air bearing spindles
- CNC machining for metal-backed boards
Lamination…
- Multi-layer capability to customer specification
- Conductive boning of printed circuit boards to aluminum, brass and copper. Resistance
Artwork…
- Original film
- Mylars
- CAD/CAM utilizing Gerber data, Autocad (DXF, DWG, HPGL) formats
- American Standard Computer Information Exchange (ASCII)
- Files received via modem, disc, or Internet